Розмір шрифту:
STRENGTH AND PLASTICITY OF SPD COPPER AT LOW TEMPERATURES
Остання редакція: 2018-05-29
Тези доповіді
Main microstructural features of ultrafine-grained polycrystalline oxygen-free copper obtained by direct and equal-channel angular hydrostatic extrusion were studied by EBSD and XRD methods. The effect of microstructure on the temperature dependences of the yield stress was investigated using tensile tests in the insufficiently studied temperature range of 4.2–300 K.
Ключові слова
Ultrafine grained materials; copper; yield strength; low temperature; dislocations; thermally activated deformation
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